Odisha semiconductor project

Odisha 3D semiconductor unit project 2026 brings India’s first advanced chip packaging facility at Info Valley with ₹2000 crore investment, boosting jobs, AI, defence and electronics sector growth. Odisha to Host India’s First 3D Semiconductor Unit at Info Valley: ₹2000 Crore Project Launched Introduction: A Landmark Step in India’s Semiconductor Journey India has taken a…